Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
| Line 71: | Line 71: | ||
|10Å to 1 µm* | |10Å to 1 µm* | ||
|10Å to ~0.5µm (very time consuming ) | |10Å to ~0.5µm (very time consuming ) | ||
|10Å to 0. | |10Å to 0.3 µm*** (this uses all Al in the boat) | ||
|10Å to 0.5 µm** | |10Å to 0.5 µm** | ||
|- | |- | ||
| Line 225: | Line 225: | ||
Pumpdown approx. 1 hour. | Pumpdown approx. 1 hour. | ||
| Pumpdown approx. 1 hour. | | Pumpdown approx. 1 hour. | ||
|'''**'''Thickness above | |'''***'''Thickness above 120 nm: ask for permission | ||
Pumpdown approx. 1 hour. | Pumpdown approx. 1 hour. | ||
| Line 236: | Line 236: | ||
'''**''' ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@danchip.dtu.dk'' | '''**''' ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@danchip.dtu.dk'' | ||
'''**''' ''For thicknesses above 120 nm please get permission from ThinFilm group by writing to metal@danchip.dtu.dk'' | |||
==Aluminium deposition on ZEP520A for lift-off== | ==Aluminium deposition on ZEP520A for lift-off== | ||