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Specific Process Knowledge/Wafer Information: Difference between revisions

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Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
Line 23: Line 23:
|500 µm
|500 µm
|1-20 Ωcm
|1-20 Ωcm
|-
|-
|-
!SSP (single side polished)
!SSP (single side polished)
Line 30: Line 29:
|525 µm
|525 µm
|1-20 Ωcm
|1-20 Ωcm
|-
|-
|-
!SSP (single side polished)
!SSP (single side polished)
|6"
|6"
|N or P
|N
|625 µm
|625 µm
|1-20 Ωcm
|10-20 Ωcm
|-
|-
|-
!SSP (single side polished)
!SSP (single side polished)
Line 44: Line 41:
|725 µm
|725 µm
|1-10 Ωcm
|1-10 Ωcm
|-
|-
|-
!DSP (double side polished)
!DSP (double side polished)
|4"
|4"
|N or P
|N or P
|350 µm or 500 µm
|350 µm  
|1-20 Ωcm
|1-20 Ωcm
|-
|-
!DSP (double side polished)
!DSP (double side polished)
|4"
|4"
|N or P
|N
|350 µm or 500 µm
|500 µm
|1-20 Ωcm
|-
!DSP (double side polished)
|6"
|N
|500 µm
|1-20 Ωcm
|1-20 Ωcm
|-
|-
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