Specific Process Knowledge/Characterization

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Overview of characteristics and where to measure it

Optical Micro- scopes

SEM (incl. EDX)

AFM

Stylus profiler

Optical profiler

Filmtek (reflec- tometer)

Ellip- someter

Thickness stylus

XPS

PL mapper

4-point probe

Probe station

XRD

Life time scanner

Drop shape analyser

Hardness tester

Differential Scanning Calorimeter DSC

Surfscan

IR-camera

Breakdown voltage

Charge carrier life time

x

Contact angle hydrophobic/hydrophillic

x

Crystallinity

x

x

Deposition uniformity

x

x

x

Dimensions(in plane)

x

x

(x)

(x)

x

Dimensions(height)

(x)

(x)

x

x

x

Electrical conductivity

x

Element analysis

x

x

x 4)

x 4)

Film stress

x

x

Imaging

x

x

x

x

Material Hardness

x

Optical gap

x

x

Particles

x

x

x

x

Phase changes

x

Reflectivity

x

x

x 6)

Refractive index

x

x

Resistivity

x

Step coverage

x 1)

x 1)

Surface roughness

x

x

x

Thermal conductivity

Thin film thickness

x 1)

x 1)

x 2)

x 2)

x

x

x

x 5)

x 3)

x

Voids in wafer bonding

x

x

x

Wafer thickness

x 1)

x 1)

x

1. Using the cross section method
2. Using the create step method
3. With known resistivity
4. Composition information for crystalline materials
5. Only single layer
6. Good for characterization of VCSEL structures and DBR mirrors

Choose characterization topic

• Element analysis
• Measurement of film thickness and optical constants
• Photoluminescence mapping
• Sample imaging
• Sample preparation for inspection
• Stress measurement
• Hardness measurement
• Wafer thickness measurement
• Topographic measurement

• Contact angle measurement
• Four-Point Probe (Resistivity measurement)
• Carrier density (doping) profiler
• Scanning Electron Microscopy

Choose equipment

AFM

• AFM - Atomic Force Microscopy

Element analysis

• SEM with EDX
• XPS-ThermoScientific

Optical and stylus profilers

• Optical Profiler (Sensofar)
• Dektak XTA_new
• Dektak 8 stylus profiler
• III V Profiler

Optical microscopes

• Optical microscopes

Optical characterization

• Ellipsometer
• Filmtek 4000
• Prism Coupler
• PL mapper - Photoluminescence mapper
• Lifetime scanner MDPmap

SEMs at CEN

• FIB-SEM FEI QUANTA 200 3D
• Dual Beam FEI Helios Nanolab 600
• SEM FEI Nova 600 NanoSEM
• SEM FEI Quanta 200 ESEM FEG
• SEM Inspect S

SEMs at Danchip

• SEM Comparison page
• SEM LEO
• SEM Supra 1
• SEM Supra 2
• SEM Supra 3
• SEM Tabletop 1

TEMs at CEN

• Titan ATEM
• Titan ETEM
• Tecnai TEM

Electrical measurements

• 4-Point Probe
• Probe station
• III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)

Various

• Drop Shape Analyzer
• Thickness Measurer
• DSC Perkin Elmer - Differential Scanning Calorimetry
• Hardness tester
• KLA-Tencor Surfscan 6420
• X-Ray Diffractometer
• XRD SmartLab