Specific Process Knowledge/Characterization/XPS/Processing/ALDSandwich1: Difference between revisions

Revision as of 09:56, 16 October 2018 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,569 edits →XPS analysis of ALD deposited layers ← Older edit		Revision as of 09:57, 16 October 2018 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,569 edits →Data processing Newer edit →
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	==== [[Specific Process Knowledge/Characterization/XPS/Processing/ALDSandwich1/1Open\|1. Open the experiment and prepare processing grids]] ====		==== [[Specific Process Knowledge/Characterization/XPS/Processing/ALDSandwich1/1Open\|1. Open the experiment and prepare processing grids]] ====

	~~Depth profile of ALD layers: Silicon wafer with 15 nm Al<sub>2<~~/~~sub>O<sub>3<~~/~~sub>, 15 nm of TiO<sub>2<~~/~~sub> and 16 nm of HfO<sub>~~2~~</sub>~~		==== [[Specific Process Knowledge/Characterization/XPS/Processing/ALDSandwich1/2Survey\|2. Survey spectra procesing]] ====