Specific Process Knowledge/Characterization/XPS/Processing/ALDSandwich1: Difference between revisions
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==== [[Specific Process Knowledge/ | ==== [[Specific Process Knowledge/Characterization/XPS/Processing/ALDSandwich1/1Open|1. Open the experiment and prepare processing grids]] ==== | ||
[[Specific Process Knowledge/Characterization/XPS/Processing/ALDSandwich1|Depth profile of ALD layers: Silicon wafer with 15 nm Al<sub>2</sub>O<sub>3</sub>, 15 nm of TiO<sub>2</sub> and 16 nm of HfO<sub>2</sub> ]] | [[Specific Process Knowledge/Characterization/XPS/Processing/ALDSandwich1|Depth profile of ALD layers: Silicon wafer with 15 nm Al<sub>2</sub>O<sub>3</sub>, 15 nm of TiO<sub>2</sub> and 16 nm of HfO<sub>2</sub> ]] | ||