Specific Process Knowledge/Characterization: Difference between revisions
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==Overview of characteristics and where to measure it== | ==Overview of characteristics and where to measure it== | ||
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| width="50" align="center" style="background:#f0f0f0;"|'''Micro- scopes''' | | width="50" align="center" style="background:#f0f0f0;"|'''Micro- scopes''' | ||
| width="50" align="center" style="background:#f0f0f0;"|'''SEM (incl. EDX)''' | | width="50" align="center" style="background:#f0f0f0;"|'''SEM (incl. EDX)''' | ||
Revision as of 07:00, 1 October 2018
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Overview of characteristics and where to measure it
| Micro- scopes | SEM (incl. EDX) | AFM | Stylus profiler | Optical profiler | Filmtek (reflec- tometer) | Ellip- someter | Thickness stylus | XPS | PL mapper | 4-point probe | Probe station | XRD | Life time scanner | Drop shape analyser | Hardness tester | |
| Thin film thickness | x 1) | x 1) | x 2) | x 2) | x | x | x | x 3) | x | |||||||
| Defects | x | x | ||||||||||||||
| Wafer thickness | x 1) | x 1) | x | |||||||||||||
| Step coverage | x 1) | x 1) | ||||||||||||||
| Particles | x | x | x | |||||||||||||
| Element analysis | x | x | x 4) | x 4) | ||||||||||||
| Surface roughness | x | x | x | |||||||||||||
| Deposition uniformity | x | x | x | |||||||||||||
| Film stress | x | x | ||||||||||||||
| Refractive index | x | x | ||||||||||||||
| Reflectivity | x | x | (x) | |||||||||||||
| Resistivity | x | |||||||||||||||
| Breakdown voltage | ||||||||||||||||
| Electrical conductivity | x | |||||||||||||||
| Thermal conductivity | ||||||||||||||||
| Optical gap | x | x | ||||||||||||||
| Crystalinity | x | |||||||||||||||
| Charge carrier life time | x | |||||||||||||||
| Contact angle hydrofob/hydrofil | x | |||||||||||||||
| Material Hardness | x | |||||||||||||||
- Using the cross section method
- Using the create step method
- With known resistivity
- Composition information
Choose characterization topic
- Element analysis
- Measurement of film thickness and optical constants
- Photoluminescence mapping
- Sample imaging
- Sample preparation for inspection
- Stress measurement
- Hardness measurement
- Wafer thickness measurement
- Topographic measurement
- Contact angle measurement
- Four-Point Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy
Choose equipment
AFM
Element analysis
Optical and stylus profilers
Optical microscopes
Optical characterization
- Ellipsometer
- Filmtek 4000
- Prism Coupler
- PL mapper - Photoluminescence mapper
- Lifetime scanner MDPmap
SEM's at CEN
- FIB-SEM FEI QUANTA 200 3D
- Dual Beam FEI Helios Nanolab 600
- SEM FEI Nova 600 NanoSEM
- SEM FEI Quanta 200 ESEM FEG
- SEM Inspect S