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Specific Process Knowledge/Etch/KOH Etch/ProcessInfo: Difference between revisions

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Jehan (talk | contribs)
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It is possible to protect the backside of the wafer against KOH.
It is possible to protect the backside of the wafer against KOH.
Two different solutions has been used:
Two different solutions has been used:
* Using special wafer holder.[[File:Tandem4.png|400px]][[File:Tandem4 b.png|400px]][[:File:AMMT_PI_WETandem.pdf]]
* Using special wafer holder. [[File:AMMT_PI_WETandem.pdf]] [[File:Tandem4.png|200px|thumb]][[File:Tandem4 b.png|200px|thumb]]
* using spin-on film (PtoTec B3)
* using spin-on film (ProTec B3 from Brewer Science link: [https://www.brewerscience.com/products/protek-b3/ Protek B3])


Please ask the Wet chemistry team for more information.
Please ask the Wet chemistry team for more information.