Specific Process Knowledge/Etch/KOH Etch/ProcessInfo: Difference between revisions
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It is possible to protect the backside of the wafer against KOH. | It is possible to protect the backside of the wafer against KOH. | ||
Two different solutions has been used: | Two different solutions has been used: | ||
* Using special wafer holder.[[File: | * Using special wafer holder. [[File:AMMT_PI_WETandem.pdf]] [[File:Tandem4.png|200px|thumb]][[File:Tandem4 b.png|200px|thumb]] | ||
* using spin-on film ( | * using spin-on film (ProTec B3 from Brewer Science link: [https://www.brewerscience.com/products/protek-b3/ Protek B3]) | ||
Please ask the Wet chemistry team for more information. | Please ask the Wet chemistry team for more information. | ||