Specific Process Knowledge/Characterization

Feedback to this page: click here

Overview of characteristics and where to measure it

'

Micro- scopes| width="50" align="center" style="background:#f0f0f0;"|SEM (incl. EDX)| width="50" align="center" style="background:#f0f0f0;"|AFM| width="50" align="center" style="background:#f0f0f0;"|Stylus profiler| width="50" align="center" style="background:#f0f0f0;"|Optical profiler| width="50" align="center" style="background:#f0f0f0;"|Filmtek (reflec- tometer)| width="50" align="center" style="background:#f0f0f0;"|Ellip- someter| width="50" align="center" style="background:#f0f0f0;"|Thick- ness stylus| width="50" align="center" style="background:#f0f0f0;"|XPS| width="50" align="center" style="background:#f0f0f0;"|PL mapper| width="50" align="center" style="background:#f0f0f0;"|4-point probe| width="50" align="center" style="background:#f0f0f0;"|Probe station| width="50" align="center" style="background:#f0f0f0;"|XRD| width="50" align="center" style="background:#f0f0f0;"|Life time scanner| width="50" align="center" style="background:#f0f0f0;"|Drop shape analyser| width="50" align="center" style="background:#f0f0f0;"|Hard- ness tester

Thin film thickness

x 1)

x 1)

x 2)

x 2)

x

x

x

x 3)

x

Defects

x

x

Wafer thickness

x 1)

x 1)

x

Step coverage

x 1)

x 1)

Particles

x

x

x

Element analysis

x

x

x 4)

x 4)

Surface roughness

x

x

x

Deposition uniformity

x

x

x

Film stress

x

x

Refractive index

x

x

Reflectivity

x

x

(x)

Resistivity

x

Breakdown voltage

Electrical conductivity

x

Thermal conductivity

Optical gap

x

x

Crystalinity

x

Charge carrier life time

x

Contact angle hydrofob/hydrofil

x

Material Hardness

x

1. Using the cross section method
2. Using the create step method
3. With known resistivity
4. Composition information

Choose characterization topic

• Element analysis
• Measurement of film thickness and optical constants
• Photoluminescence mapping
• Sample imaging
• Sample preparation for inspection
• Stress measurement
• Hardness measurement
• Wafer thickness measurement
• Topographic measurement

• Contact angle measurement
• Four-Point Probe (Resistivity measurement)
• Carrier density (doping) profiler
• Scanning Electron Microscopy

Choose equipment

AFM

• AFM - Atomic Force Microscopy

Element analysis

• Atomika SIMS
• XPS-ThermoScientific

Optical and stylus profilers

• Optical Profiler (Sensofar)
• Dektak XTA_new
• Dektak 8 stylus profiler
• III V Profiler

Optical microscopes

• Optical microscope

Optical characterization

• Ellipsometer
• Filmtek 4000
• Prism Coupler
• PL mapper - Photoluminescence mapper
• Lifetime scanner MDPmap

SEM's at CEN

• FIB-SEM FEI QUANTA 200 3D
• Dual Beam FEI Helios Nanolab 600
• SEM FEI Nova 600 NanoSEM
• SEM FEI Quanta 200 ESEM FEG
• SEM Inspect S

SEM's at Danchip

• SEM Comparison page
• SEM LEO
• SEM Supra 1
• SEM Supra 2
• SEM Supra 3
• SEM Tabletop 1

TEM's at CEN

• Titan ATEM
• Titan ETEM
• Tecnai TEM

Various

• Drop Shape Analyzer

• 4-Point Probe

• Thickness Measurer

• Probe station

• KLA-Tencor Surfscan 6420
• III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)
• X-Ray Diffractometer
• XRD SmartLab