Specific Process Knowledge/Characterization: Difference between revisions

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== Choose equipment ==
== Choose equipment ==


'''AFM'''
===AFM===
*[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']]
*[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']]


'''Element analysis'''
===Element analysis===
*[[/SIMS: Secondary Ion Mass Spectrometry#Atomika_SIMS|Atomika SIMS]]
*[[/SIMS: Secondary Ion Mass Spectrometry#Atomika_SIMS|Atomika SIMS]]
*[[/XPS#XPS-ThermoScientific|XPS-ThermoScientific ]]
*[[/XPS#XPS-ThermoScientific|XPS-ThermoScientific ]]


'''Optical and stylus profilers'''
===Optical and stylus profilers===
*[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
*[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
*[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]]
*[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]]
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'''SEM's at CEN'''
===SEM's at CEN===
*[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]]
*[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]]
*[[LabAdviser/CEN/Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]]
*[[LabAdviser/CEN/Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]]
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*[[LabAdviser/CEN/Inspect S|SEM Inspect S]]
*[[LabAdviser/CEN/Inspect S|SEM Inspect S]]


'''SEM's at Danchip'''
===SEM's at Danchip===
*[[/SEM: Scanning Electron Microscopy |SEM Comparison page]]
*[[/SEM: Scanning Electron Microscopy |SEM Comparison page]]
*[[/SEM LEO|SEM LEO]]
*[[/SEM LEO|SEM LEO]]
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*[[/SEM Tabletop 1|SEM Tabletop 1]]
*[[/SEM Tabletop 1|SEM Tabletop 1]]


'''TEM's at CEN'''
===TEM's at CEN===
*[[LabAdviser/CEN/Titan ATEM |Titan ATEM]]
*[[LabAdviser/CEN/Titan ATEM |Titan ATEM]]
*[[LabAdviser/CEN/Titan ETEM |Titan ETEM]]
*[[LabAdviser/CEN/Titan ETEM |Titan ETEM]]
*[[LabAdviser/CEN/Tecnai TEM |Tecnai TEM]]
*[[LabAdviser/CEN/Tecnai TEM |Tecnai TEM]]


'''Various'''
===Various===
*[[/Drop Shape Analyzer|Drop Shape Analyzer]]
*[[/Drop Shape Analyzer|Drop Shape Analyzer]]



Revision as of 14:06, 20 September 2018

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Overview of characteristics and where to measure it

' Microscopes SEM (incl. EDX) AFM Stylus profiler Optical profiler Filmtek (reflectometer) Ellipsometer Thickness stylus XPS PL mapper 4-point probe Probe station XRD Life time scanner Drop shape analyser Hardness tester
Thin film thickness x 1) x 1) x 2) x 2) x x x x 3) x
Defects x x
Wafer thickness x 1) x 1) x
Step coverage x 1) x 1)
Particles x x x
Element analysis x x x 4) x 4)
Surface roughness x x x
Deposition uniformity x x x
Film stress x x
Refractive index x x
Reflectivity x x (x)
Resistivity x
Breakdown voltage
Electrical conductivity x
Thermal conductivity
Optical gap x x
Crystalinity x
Charge carrier life time x
Contact angle hydrofob/hydrofil x
Material Hardness x
  1. Using the cross section method
  2. Using the create step method
  3. With known resistivity
  4. Composition information

Choose characterization topic

Choose equipment

AFM

Element analysis

Optical and stylus profilers

Optical microscopes

Optical characterization


SEM's at CEN

SEM's at Danchip

TEM's at CEN

Various