Specific Process Knowledge/Thin film deposition/Temescal/Acceptance Test: Difference between revisions

Revision as of 13:13, 13 September 2018 view source Bghe (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators 7,318 edits →Full acceptance test report here ← Older edit		Revision as of 15:42, 14 September 2018 view source Reet (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231 1,760 edits →Acceptance test and test results Newer edit →
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	=Acceptance test and test results=		==Acceptance test and test results==
	[[File:w26 with resist02.jpg\|400px\|right\|thumb\|Si wafer with nLOF resist pattern and 10 nm Ti/100 nm Au on top. The side wall is free of deposition]]		[[File:w26 with resist02.jpg\|400px\|right\|thumb\|Si wafer with nLOF resist pattern and 10 nm Ti/100 nm Au on top. The side wall is free of deposition]]