Specific Process Knowledge/Thin film deposition/Temescal/Acceptance Test: Difference between revisions
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==Acceptance test and test results== | ==Acceptance test and test results== | ||
In the acceptance test, we tested the vacuum performance, the ion source, and the uniformity of the deposited metal films. | |||
The uniformity of the ion beam etch was tested on Si wafers with SiO2 coating of a known thickness. | The uniformity of the ion beam etch was tested on Si wafers with SiO2 coating of a known thickness. | ||
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Side wall coverage was evaluated in SEM for Ti/Au films deposited at normal incidence (what most users require, which gives no side-wall deposition) and with various degrees of tilt. | Side wall coverage was evaluated in SEM for Ti/Au films deposited at normal incidence (what most users require, which gives no side-wall deposition) and with various degrees of tilt. | ||
Full acceptance test report here: | '''Full acceptance test report here:''' | ||
[[:File:Temescal Acceptance Test Results Mar-April-May 2018.pdf]] | [[:File:Temescal Acceptance Test Results Mar-April-May 2018.pdf]] | ||
= Vacuum performance = | |||
Revision as of 16:25, 12 September 2018
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Acceptance test and test results
In the acceptance test, we tested the vacuum performance, the ion source, and the uniformity of the deposited metal films.
The uniformity of the ion beam etch was tested on Si wafers with SiO2 coating of a known thickness.
For metal films, the thickness and for Ti/Ni the sheet resistance uniformity were measured.
Side wall coverage was evaluated in SEM for Ti/Au films deposited at normal incidence (what most users require, which gives no side-wall deposition) and with various degrees of tilt.
Full acceptance test report here:
File:Temescal Acceptance Test Results Mar-April-May 2018.pdf