Specific Process Knowledge/Thin film deposition/Deposition of Titanium: Difference between revisions
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/ | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Pre-clean | ! Pre-clean | ||
| | |Ar ion beam | ||
|RF Ar clean | |RF Ar clean | ||
| | | | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | ! Layer thickness | ||
|10Å to | |10Å to 1 µm* | ||
|10Å to 1 µm* | |10Å to 1 µm* | ||
|10Å to 1000Å | |10Å to 1000Å | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Deposition rate | ! Deposition rate | ||
| | |0.5Å/s to 10Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|About 10Å/s | |About 10Å/s | ||
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! Batch size | ! Batch size | ||
| | | | ||
*Up to | *Up to 4x6" wafers | ||
*Up to 3x8" wafers (ask for holder) | |||
*smaller pieces | *smaller pieces | ||
| | | | ||
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|} | |} | ||
'''*''' ''For thicknesses above | '''*''' ''For thicknesses above 600 nm please write to metal@danchip.dtu.dk to ensure that there is enough material available.'' | ||
== Comments: Choise of equipment == | == Comments: Choise of equipment == | ||