Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
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|E-beam deposition of Cu | |E-beam deposition of Cu | ||
|Sputter deposition of Cu | |Sputter deposition of Cu | ||
|- | |- | ||
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|Ar ion bombardment | |Ar ion bombardment | ||
|RF Ar clean | |RF Ar clean | ||
|- | |- | ||
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|10Å to 1µm* | |10Å to 1µm* | ||
|10Å to 1µm** | |10Å to 1µm** | ||
|- | |- | ||
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|1Å/s to 10Å/s | |1Å/s to 10Å/s | ||
| ~1Å/s | | ~1Å/s | ||
|- | |- | ||
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*smaller pieces | *smaller pieces | ||
*Up to 1x6" wafers | *Up to 1x6" wafers | ||
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* SU-8 | * SU-8 | ||
* Metals | * Metals | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Comment | ! Comment | ||
|As of August 2018, Cu has not yet been deposited in this machine. Contact the Thin Film group to develop a process. | |As of August 2018, Cu has not yet been deposited in this machine. Contact the Thin Film group to develop a process. | ||
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|} | |} | ||