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Specific Process Knowledge/Thin film deposition/Deposition of Gold/Adhesion layers: Difference between revisions

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From the TEM bright field cross section analysis of the 2nm Ti/2nm Au sample, it is observed that 2 nm of Ti forms a continuous layer below the Au layer (Fig. 3a). The Au layer is continuous over the Ti, indicating that Ti is responsible for an interface energy decrease, acting as an adhesive. The AFM analysis of the same sample confirmed the continuous structure, and an RMS surface roughness of 0.8 nm was measured (Fig. 3b). The 2nm Ti/20nm Au sample also shows a smoother film compared to the 20nm Au sample (Fig. 3c), and the AFM analysis shows an RMS surface roughness of 0.5 nm (Fig. 3d), very similar to the one of the Si substrate.
From the TEM bright field cross section analysis of the 2nm Ti/2nm Au sample, it is observed that 2 nm of Ti forms a continuous layer below the Au layer (Fig. 3a). The Au layer is continuous over the Ti, indicating that Ti is responsible for an interface energy decrease, acting as an adhesive. The AFM analysis of the same sample confirmed the continuous structure, and an RMS surface roughness of 0.8 nm was measured (Fig. 3b). The 2nm Ti/20nm Au sample also shows a smoother film compared to the 20nm Au sample (Fig. 3c), and the AFM analysis shows an RMS surface roughness of 0.5 nm (Fig. 3d), very similar to the one of the Si substrate.
In contrast to the case with the Ti adhesion layer, TEM bright field analysis of the 2nm Cr/2nm Au sample shows a single continuous layer (Fig. 4a). The AFM RMS surface roughness is 1.2 nm (Fig. 4b). Increasing the nominal Au thickness to 20 nm for the 2nm Cr/20nm Au sample, the film still presented a single-layer morphology (Fig. 4c), while the RMS surface roughness decreased to 0.6 nm (Fig. 4d).


<gallery widths="350px" heights="350px" perrow="2" halign="center"> image:Picture5.png|Fig. 3: TEM cross section images and 300x300 nm AFM images of the 2nm Ti/2nm Au sample (a-b) and of the 2nm Ti/20nm Au sample (c-d).  
<gallery widths="350px" heights="350px" perrow="2" halign="center"> image:Picture5.png|Fig. 3: TEM cross section images and 300x300 nm AFM images of the 2nm Ti/2nm Au sample (a-b) and of the 2nm Ti/20nm Au sample (c-d).  
image:Picture7.png|Fig. 4: TEM cross section images and 300x300 nm AFM images of the 2nm Cr/2nm Au sample (a-b) and of the 2nm Cr/20nm Au sample (c-d). </gallery>
image:Picture7.png|Fig. 4: TEM cross section images and 300x300 nm AFM images of the 2nm Cr/2nm Au sample (a-b) and of the 2nm Cr/20nm Au sample (c-d). </gallery>
In contrast to the case with the Ti adhesion layer, TEM bright field analysis of the 2nm Cr/2nm Au sample shows a single continuous layer (Fig. 4a). The AFM RMS surface roughness is 1.2 nm (Fig. 4b). Increasing the nominal Au thickness to 20 nm for the 2nm Cr/20nm Au sample, the film still presented a single-layer morphology (Fig. 4c), while the RMS surface roughness decreased to 0.6 nm (Fig. 4d).


To investigate the crystal orientation of the metal thin-�lms, tramsimission Kikuchi diffraction was used (Fig. 5a). The nanostructure of the 20nm Au �lm has a bimodal grain
To investigate the crystal orientation of the metal thin-�lms, tramsimission Kikuchi diffraction was used (Fig. 5a). The nanostructure of the 20nm Au �lm has a bimodal grain