Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
→Deposition of Cu: removed Alcatel, added Temescal |
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|As of August 2018, Cu has not yet been deposited in this machine. Contact Thin Film group to develop a process. | |As of August 2018, Cu has not yet been deposited in this machine. Contact the Thin Film group to develop a process. | ||
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|Sample must be compatible with plating bath. Seed metal layer required to run electroplating process. | |Sample must be compatible with plating bath. Seed metal layer required to run electroplating process. | ||
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'''**''' ''To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@danchip.dtu.dk)'' | '''**''' ''To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@danchip.dtu.dk)'' | ||
'''*''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@danchip.dtu.dk)'' | '''*''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@danchip.dtu.dk)'' | ||