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Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions

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Deposition of Silicon using sputter deposition technique: Removed refs to Alcatel and Cryofox. Added Lesker sputterer in text
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==Deposition of Silicon using sputter deposition technique==
==Deposition of Silicon using sputter deposition technique==


At DANCHIP you can also deposit silicon using Wordentec, PVD co-sputter/evaporation or IBE Ionfab300 sputter systems. (There is also a Si sputter target in Alcatel, but the process is not running stable nowadays). One of the advantages here is that you can deposit on any material you like.  
At DANCHIP you can also deposit silicon the using Wordentec, the Lesker Sputter system or the IBE Ionfab300 sputter systems. One of the advantages here is that you can deposit on any material you like.  


* [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBSD of Si|Si deposition in IBE⁄IBSD Ionfab300]]  
* [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBSD of Si|Si deposition in IBE⁄IBSD Ionfab300]]  
* [[Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec|Si sputter in Wordentec]]
* [[Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec|Si sputter in Wordentec]]
* [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter Alcatel|Si sputter in Alcatel]]


==Comparison of the methods for deposition of Silicon==
==Comparison of the methods for deposition of Silicon==