Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic/mediumiso1: Difference between revisions

Revision as of 12:57, 30 July 2018

**Process runs**
Date	Substrate Information				Process Information				SEM Images
Date	Wafer info	Mask	Material/ Exposed area	Tool / Operator	Conditioning	Recipe	Wafer ID	Comments	SEM Images
9/4-2014	4"	travka05 wafer 1.5 µm AZ	Si / 5 %	Pegasus/jmli	5 minute TDESC clean + MU runs	jml/isotropic/mediumiso1 2:00 minutes	S003961
6/6-2016	6"	travka35 wafer 1.5 µm AZ	Si / 35 %	Pegasus/jmli		standard/danchip/mediumiso1 2:00 minutes	S006534
6/6-2016	6"	travka35 wafer 1.5 µm AZ	Si / 35 %	Pegasus/jmli		standard/danchip/mediumiso1 4:00 minutes	S006535

Revision as of 09:02, 8 June 2016 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,416 edits No edit summary ← Older edit		Revision as of 12:57, 30 July 2018 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,416 edits No edit summary Newer edit →
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