Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic/Isoslow7: Difference between revisions
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Revision as of 12:53, 30 July 2018
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 28/2-2014 | 4" | travka50 wafer 1.5 µm AZ | Si / 50 % | Pegasus/jmli | 1 minute TDESC clean + MU runs | jml/isotropic/isoslow7 1:00 minutes | S003900 | Bottom fine!! |
|
