Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/nBoost04: Difference between revisions

Revision as of 12:50, 30 July 2018

**Process runs**
Date	Substrate Information				Process Information				SEM Images
Date	Wafer info	Mask	Material/ Exposed area	Tool / Operator	Conditioning	Recipe	Wafer ID	Comments	SEM Images
24/10-2014	4" DUV-BoxC wafer	stepper mask (50 nm barc + 250 nm krf)/Si	Si / 60+ % on die	Pegasus/jmli	3 minute TDESC clean + 30 sec barc etch	danchip/jml/nano/nanoboost/nboost04 100 cycles or 13 minutes	S004436

HiRes images of S004436

Revision as of 10:59, 2 June 2016 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,416 edits Created page with " {\| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" \|+ '''Process runs''' \|- ! rowspan="2" width="40"\| Date ! colspan="4" width="120"\| Substrate Informat..."		Revision as of 12:50, 30 July 2018 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,416 edits No edit summary Newer edit →
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