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→Adhesion of Au on Si: Added Temescal. Various small tweaks
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*[[/Adhesion layers|Adhesion layers]]
*[[/Adhesion layers|Adhesion layers]]
== Au deposition ==
Below you can compare the different equipment that allows Au deposition.


{| border="1" cellspacing="0" cellpadding="4"  
{| border="1" cellspacing="0" cellpadding="4"  
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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator Temescal]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Pre-clean
! Pre-clean
|RF Ar clean
|Ar ion source
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Layer thickness
! Layer thickness
|10 Å to 5000Å*  
|10 Å to 1 µm*
|10 Å to 5000Å*
|10 Å to 5000 Å*
|10 Å to
|10 Å to
|10Å to about 3000Å*
|10 Å to about 3000 Å**
|
|
|
|
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Deposition rate
! Deposition rate
|2 Å/s to 10 Å/s
|0.5 Å/s to 10 Å/s
|1 Å/s to 10 Å/s
|1 Å/s to 10 Å/s
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! Batch size
! Batch size
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*Up to 1x4" wafers
*Up to 4x6" wafers or
*smaller pieces
*Up to 3x8" wafers (ask for special holder)
*many smaller pieces
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*24x2" wafers or  
*24x2" wafers or  
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* Silicon oxide  
*Silicon
* Silicon (oxy)nitride  
*Silicon oxide
* Photoresist  
*Silicon (oxy)nitride
* PMMA  
*Photoresist
* Mylar  
*PMMA
* SU-8
*Mylar
* Metals
*Metals
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
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* Silicon oxide  
* Silicon oxide  
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! Comment
! Comment
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* For thicknesses above 200 nm permission is required
* For thicknesses above 600 nm permission is required
* An adhesion layer (of Cr or Ti) is recommended under Au.
* An adhesion layer (of Cr or Ti) is recommended under Au.
* Takes approx. 20 min to pump down.
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* For thicknesses above 200 nm permission is required
* For thicknesses above 600 nm permission is required
* An adhesion layer (of Cr or Ti) is recommended under Au.
* An adhesion layer (of Cr or Ti) is recommended under Au.
* Takes approx. 1 hour to pump down.
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|
|
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* For thicknesses above 200 nm permission is required
* An adhesion layer (of Cr or Ti) is recommended under Au.


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* Used for gold sputter coating of samples before SEM inspection
* Used for gold sputter coating of samples before SEM inspection
* Very fast.
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* Used for gold sputter coating of samples before SEM inspection
* Used for gold sputter coating of samples before SEM inspection
*Very fast.
|-
|-
|}
|}




'''*'''  ''For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.''
'''*'''  ''For thicknesses above 600 nm write to metal@danchip.dtu.dk to ensure that there will be enough material in the machine.''
 
'''**'''  ''For thicknesses above 200 nm write to metal@danchip.dtu.dk to ensure that there will be enough material in the machine.''


== Studies of Au deposition processes in the Wordentec==
== Studies of Au deposition processes in the Wordentec==
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold"