Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions

@@ Line 216: / Line 216: @@
 |'''*''' Thickness above 600 nm: ask for permission
-It is possible to tilt the substrate. Pumpdown approx. 20 min.
+It is possible to tilt the substrate.
+Pumpdown approx. 20 min.
-|'''**''' Thickness above 200 nm: ask for permission. Pumpdown approx. 1 hour.
+|'''**''' Thickness above 200 nm: ask for permission.
-|'''*''' Thickness above 600 nm: ask for permission Pumpdown approx. 1 hour.
+Pumpdown approx. 1 hour.
+|'''*''' Thickness above 600 nm: ask for permission.
+Pumpdown approx. 1 hour.
 | Pumpdown approx. 1 hour.
 |'''**'''Thickness above 200 nm: ask for permission
-|'''**'''Thickness above 200 nm: ask for permission. Pumpdown approx. 10 min.
+|'''**'''Thickness above 200 nm: ask for permission.
+Pumpdown approx. 10 min.
 |}