Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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! Comment | ! Comment | ||
| Pumpdown approx 20 min. | | Pumpdown approx 20 min. Possible to tilt the wafer. | ||
| Pumpdown approx 10 min. | | Pumpdown approx 10 min. | ||
| Only very thin layers. Pumpdown approx 1 hour. | | Only very thin layers. Pumpdown approx 1 hour. | ||