Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Lesker|Lesker]] - ''Sputter tool'' | *[[/Lesker|Lesker]] - ''Sputter tool'' | ||
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | ||
*[[/thermalevaporator|Thermal evaporator]] - ''Thermal evaporator'' | *[[/thermalevaporator|Thermal evaporator]] - ''Thermal evaporator'' | ||
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*[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal) | *[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal) | ||
*[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Atomic Layer Deposition (thermal and plasma enhanced) | *[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Atomic Layer Deposition (thermal and plasma enhanced) | ||
*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Will be decommissioned</span>) ''E-beam evaporator and sputter tool'' | |||
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' | |||
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See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers | See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers | ||