Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
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==Other stuff to add [[Image:section under construction.jpg|70px]]== | ==Other stuff to add [[Image:section under construction.jpg|70px]]== | ||
*How e-beam evaporation works (is it elsewhere?) | *How e-beam evaporation works (is it elsewhere?) and why you need to be aware that the e-beam hits the metal and not the crucible | ||
*How the machine measures the thickness (QCM, why tooling factor may depend on deposition rate, why is stress and delamination an issue) | *How the machine measures the thickness (QCM, why tooling factor may depend on deposition rate, why is stress and delamination an issue) | ||
*Line-of-sight deposition | *Line-of-sight deposition | ||
*Results from Acceptance test including SEM images and stuff about ion etch rate | *Results from Acceptance test including SEM images and stuff about ion etch rate | ||
*Stuff that we say in the manual that you can see on Labadvisor | *Stuff that we say in the manual that you can see on Labadvisor | ||
*Stuff about the Hula | |||
*Stuff about heating during deposition and water cooling and cooling times | |||