Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
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'''*''' ''For thicknesses above 600 nm please request permission so we can ensure that enough material will be present.'' | '''*''' ''For thicknesses above 600 nm please request permission so we can ensure that enough material will be present.'' | ||
'''**''' ''Defined as the ratio of the standard deviation to the average of the measurement made using the DektakXT'' | '''**''' ''Defined as the ratio of the standard deviation to the average of the measurement made using the DektakXT'' | ||
==Quality control (QC) for the Temescal== | |||
We are still developing the QC procedure for the Temescal (July 2018). | |||
==Other stuff to add==[[Image:section under construction.jpg|70px]] | |||
How e-beam evaporation works (is it elsewhere?) | |||
How the machine measures the thickness (QCM, why tooling factor may depend on deposition rate, why is stress and delamination an issue) | |||
Line-of-sight deposition | |||
Results from Acceptance test including SEM images and stuff about ion etch rate | |||
Stuff that we say in the manual that you can see on Labadvisor | |||