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E Beam Evaporator (Temescal)

The Temescal is a system for depositing metals by electron-beam evaporation. It also has an ion source for in-situ Argon sputtering that can be used either for cleaning samples prior to deposition or to modify the film during deposition. Wafers are loaded into the top of the chamber, which acts as a loadlock as it can be separated from the rest of the chamber by a large gate valve. Deposition will happen on all samples that are loaded together. You can load up to four 6" wafers or three 8" wafers for line-of sight deposition, or up to one 6" wafer for tilted deposition (smaller samples may be tilted more). By using different sample holder inserts, you can deposit metals on samples of different sizes and shapes. The system contains 6 metals at a time and the metals are exchanged based on user requests, so please request the metals you wish well in advance.

The Temescal E-beam evaporator in cleanroom A-5

The user manual, user APV, and contact information can be found in LabManager:

E Beam Evaporator (Temescal) in LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

Equipment performance and process related parameters

Equipment		Equipment 1	Equipment 2
Purpose		Purpose 1 Purpose 2	Purpose 1 Purpose 2 Purpose 3
Performance	Response 1	Performance range 1 Performance range 2	Performance range 1 Performance range 2 Performance range 3
Performance	Response 2	Performance range	Performance range
Process parameter range	Parameter 1	Range	Range
Process parameter range	Parameter 2	Range	Range
Substrates	Batch size	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
	Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3

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 =E Beam Evaporator (Temescal)=
-The Temescal is a system for depositing metals by electron-beam evaporation. It also has an ion source for in-situ Argon sputtering that can be used either for cleaning samples prior to deposition or to modify the film during deposition. Wafers are loaded into the top of the chamber, which acts as a loadlock as it can be separated from the rest of the chamber by a large gate valve. Deposition will happen on all samples that are loaded together. You can load up to four 6'' wafers or three 8'' wafers for line-of sight deposition, or up to one 6'' wafer for tilted deposition (smaller samples may be tilted more). By using different sample holder inserts, you can deposit metals on samples of different sizes and shapes. The system contains 6 metals at a time and the metals are exchanged based on user requests, so please request the metals you wish well in advance.
+The Temescal is a system for depositing metals by electron-beam evaporation. It also has an ion source for in-situ Argon sputtering that can be used either for cleaning samples prior to deposition or to modify the film during deposition. Wafers are loaded into the top of the chamber, which acts as a loadlock as it can be separated from the rest of the chamber by a large gate valve. Deposition will happen on all samples that are loaded together. You can load up to four 6" wafers or three 8" wafers for line-of sight deposition, or up to one 6" wafer for tilted deposition (smaller samples may be tilted more). By using different sample holder inserts, you can deposit metals on samples of different sizes and shapes. The system contains 6 metals at a time and the metals are exchanged based on user requests, so please request the metals you wish well in advance.
 [[File:Temescal.JPG|400px|right|thumb|The Temescal E-beam evaporator in cleanroom A-5]]