Specific Process Knowledge/Etch/DryEtchProcessing/Comparison: Difference between revisions
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| style="background:WhiteSmoke; color:black"| Formerly the primary silicon etcher; now polymers, Silicon oxides and nitrides may also be etched. 5% metal on the surface is allowed. | | style="background:WhiteSmoke; color:black"| Formerly the primary silicon etcher; now polymers, Silicon oxides and nitrides may also be etched. 5% metal on the surface is allowed. | ||
| style="background:WhiteSmoke; color:black"| Etching of silicon oxides or nitrides | | style="background:WhiteSmoke; color:black"| Etching of silicon oxides or nitrides | ||
| style="background:WhiteSmoke; color:black" colspan"2" | Silicon etching | | style="background:WhiteSmoke; color:black" colspan="2" | Silicon etching | ||
| style="background:WhiteSmoke; color:black"| Standard recipes for etching of Al, Cr and Ti, now also etches of W, TiW and Mo | | style="background:WhiteSmoke; color:black"| Standard recipes for etching of Al, Cr and Ti, now also etches of W, TiW and Mo | ||
| style="background:WhiteSmoke; color:black"| Etching of silicon oxide, resist, BCB, silicon nitride, InP, InGaAs and GaAs on III-V substrates | | style="background:WhiteSmoke; color:black"| Etching of silicon oxide, resist, BCB, silicon nitride, InP, InGaAs and GaAs on III-V substrates | ||
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! style="background:lightgrey; color:black" | Alternative/backup uses | ! style="background:lightgrey; color:black" | Alternative/backup uses | ||
| style="background:lightgrey; color:black" | Backup silicon etcher | | style="background:lightgrey; color:black" | Backup silicon etcher | ||
| style="background:lightgrey; color:black" colspan"2" | | | style="background:lightgrey; color:black" colspan="2" | | ||
| style="background:lightgrey; color:black" | Barc etch | | style="background:lightgrey; color:black" | Barc etch | ||
| style="background:lightgrey; color:black" | Silicon etcher | | style="background:lightgrey; color:black" | Silicon etcher | ||
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| style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | | style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | ||
| style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | | style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | ||
| style="background:WhiteSmoke; color:black" colspan"2" | Inductively coupled plasma chamber with two RF generators; the coil (with outer and inner coil) and platen generator | | style="background:WhiteSmoke; color:black" colspan="2" | Inductively coupled plasma chamber with two RF generators; the coil (with outer and inner coil) and platen generator | ||
| style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | | style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator | ||
| style="background:WhiteSmoke; color:black" | Parallel plate capacitor setup with RF power between the two electrodes | | style="background:WhiteSmoke; color:black" | Parallel plate capacitor setup with RF power between the two electrodes | ||
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| style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 20<sup>o</sup>C | | style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 20<sup>o</sup>C | ||
| style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 60<sup>o</sup>C | | style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 60<sup>o</sup>C | ||
| style="background:lightgrey; color:black" colspan"2" | The electrode is oil cooled. Also, Helium backside cooling: -20<sup>o</sup>C to 30<sup>o</sup>C | | style="background:lightgrey; color:black" colspan="2" | The electrode is oil cooled. Also, Helium backside cooling: -20<sup>o</sup>C to 30<sup>o</sup>C | ||
| style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 50<sup>o</sup>C | | style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 50<sup>o</sup>C | ||
| style="background:lightgrey; color:black" | The electrode is oil cooled: Fixed at 20<sup>o</sup>C | | style="background:lightgrey; color:black" | The electrode is oil cooled: Fixed at 20<sup>o</sup>C | ||
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| style="background:WhiteSmoke; color:black" | Electrostatic clamping (semco electrode) | | style="background:WhiteSmoke; color:black" | Electrostatic clamping (semco electrode) | ||
| style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC) | | style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC) | ||
| style="background:WhiteSmoke; color:black" colspan"2" | Electrostatic clamping (TDESC) | | style="background:WhiteSmoke; color:black" colspan="2" | Electrostatic clamping (TDESC) | ||
| style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC) | | style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC) | ||
| style="background:WhiteSmoke; color:black" | No clamping | | style="background:WhiteSmoke; color:black" | No clamping | ||