Specific Process Knowledge/Etch/DryEtchProcessing/Comparison: Difference between revisions
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{| border="2" cellspacing="0" cellpadding="0" align="center" | {| border="2" cellspacing="0" cellpadding="0" align="center" | ||
! colspan="2" style="background:silver; color:black" | | ! colspan="2" style="background:silver; color:black" | | ||
! style="background:silver; color:black" | [[Specific Process Knowledge/Etch/ASE_(Advanced_Silicon_Etch)| ASE]] | ! style="background:silver; color:black" rowspan="2" | [[Specific Process Knowledge/Etch/ASE_(Advanced_Silicon_Etch)| ASE]] | ||
! style="background:silver; color:black" | [[Specific Process Knowledge/Etch/AOE_(Advanced_Oxide_Etch)| AOE]] | ! style="background:silver; color:black" rowspan="2" | [[Specific Process Knowledge/Etch/AOE_(Advanced_Oxide_Etch)| AOE]] | ||
! style="background:silver; color:black" | [[Specific Process Knowledge/Etch/DRIE-Pegasus| DRIE-Pegasus]] | ! style="background:silver; color:black" colspan="2" | [[Specific Process Knowledge/Etch/DRIE-Pegasus| DRIE-Pegasus]] | ||
! style="background:silver; color:black" | [[Specific Process Knowledge/Etch/ICP_Metal_Etcher| ICP Metal etch ]] | ! style="background:silver; color:black" rowspan="2" | [[Specific Process Knowledge/Etch/ICP_Metal_Etcher| ICP Metal etch ]] | ||
! style="background:silver; color:black" | [[Specific Process Knowledge/Etch/III-V RIE |III-V RIE ]] | ! style="background:silver; color:black" rowspan="2" | [[Specific Process Knowledge/Etch/III-V RIE |III-V RIE ]] | ||
! style="background:silver; color:black" | [[Specific Process Knowledge/Etch/III-V ICP|III-V ICP]] | ! style="background:silver; color:black" rowspan="2" | [[Specific Process Knowledge/Etch/III-V ICP|III-V ICP]] | ||
|- valign="top" | |||
! Pegasus 1 | | |||
! Pegasus 2 | | |||
|- valign="top" | |- valign="top" | ||
! rowspan="2" style="background:silver; color:black" width="120" |Purpose | ! rowspan="2" style="background:silver; color:black" width="120" |Purpose | ||