Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation: Difference between revisions
| Line 49: | Line 49: | ||
: The etched depth (ED) is rather self explanatory: ED <math>\times</math> PS | : The etched depth (ED) is rather self explanatory: ED <math>\times</math> PS | ||
; Etch rate (nm or µm | ; Etch rate (expressed either as nm/min or µm/min or as nm/cyc or µm/cyc) | ||
: Divide the etched depth (ED) by the etch time (ET) of the process: <math> \tfrac{\mathrm{ED} \times \mathrm{PS}}{\mathrm{ET}}</math> | : Divide the etched depth (ED) by the etch time (ET) or the number of Bosch cycles of the process: | ||
: <math> \tfrac{\mathrm{ED} \times \mathrm{PS}}{\mathrm{ET}}</math> | |||
: or | |||
: <math> \tfrac{\mathrm{ED} \times \mathrm{PS}}{\mathrm{NC}}</math> | |||
; Sidewall bowing (%) | ; Sidewall bowing (%) | ||
| Line 85: | Line 91: | ||
: <math> \cos^{-1}(\tfrac{ | : <math> \cos^{-1}(\tfrac{ | ||
\alpha}{\sqrt{\mathrm{ED}^2+\alpha^2}}) </math> with <math> \alpha = \tfrac{\mathrm{TW}-\mathrm{BW}}{2} </math> | \alpha}{\sqrt{\mathrm{ED}^2+\alpha^2}}) </math> with <math> \alpha = \tfrac{\mathrm{TW}-\mathrm{BW}}{2} </math> | ||
=== Omissions === | === Omissions === | ||
The numbers and measurements above ignore | The numbers and measurements above ignore | ||