Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions
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This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see [[/Sputtering of TiW in Wordentec|here]]) and may change with these settings. | This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see [[/Sputtering of TiW in Wordentec|here]]) and may change with these settings. | ||
'''Deposited film characteristics''' | |||
AFM pictures show how the surface roughness is dependent of the process parameters, this can be seen here. | |||