Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation: Difference between revisions
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=== Input parameters === | === Input parameters === | ||
'''At the SEM''' | |||
Many users make measurements using the annotations in the SEM. However, instead of adding a ton of measurements to each SEM image while at the SEM and hence spend an unreasonable amount of time there, one can postpone making the measurements till afterwards. The only requirement is that the pixel size of every SEM image is known - one can add it to the datazone: See any SEM manual for instructions - for instance [http://labmanager.dtu.dk/d4Show.php?id=2180&mach=275#dafs29430 '''HERE'''] | Many users make measurements using the annotations in the SEM. However, instead of adding a ton of measurements to each SEM image while at the SEM and hence spend an unreasonable amount of time there, one can postpone making the measurements till afterwards. The only requirement is that the pixel size of every SEM image is known - one can add it to the datazone: See any SEM manual for instructions - for instance [http://labmanager.dtu.dk/d4Show.php?id=2180&mach=275#dafs29430 '''HERE'''] | ||
'''Making measurements''' | |||
Opening the SEM images with Irfanview (or any other image viewer with the same possibilities) and drawing squares (the pixel dimensions are shown in the top) as measurements. These squares are one pixel wide compared to the 2 (or even 3) which are default for the annotations in smartSEM. | |||
; Pixel Size (PS) | ; Pixel Size (PS) | ||
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: In case of a Bosch process, the number of cycles may be used instead of the process time. | : In case of a Bosch process, the number of cycles may be used instead of the process time. | ||
; Etch Time (ET) | ; Etch Time (ET) | ||
: . | : The duration of the etch process expressed as a number (5.5 minutes rather than mm:ss 5:30). | ||
; Mask Thickness (MT) | ; Mask Thickness (MT) | ||
: The thickness of the mask prior to etching. | : The thickness of the mask prior to etching. | ||
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: The thickness of the mask after etching. | : The thickness of the mask after etching. | ||
; Mask Opening (MO) | ; Mask Opening (MO) | ||
: The width of the mask opening. | : The width of the mask opening measured at the mask/substrate interface. | ||
; Top Width (TW) | ; Top Width (TW) | ||
: The narrowest part of the open feature near the | : The narrowest part of the open feature near the mask/substrate interface. | ||
; Mid Width (MW) | ; Mid Width (MW) | ||
: The width of the trench at half the distance to the bottom of the trench. | : The width of the trench at half the distance to the bottom of the trench. | ||
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; Etched Depth (ED) | ; Etched Depth (ED) | ||
: The distance from the top to the bottom of the trench.. | : The distance from the top to the bottom of the trench.. | ||
=== Output parameters === | === Output parameters === | ||