Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation: Difference between revisions

Revision as of 13:24, 28 June 2018


	In the image the following parameters are shown: Top Width (TW) Depth (D) Bottom Width (BW) Mid Width (MW) To speed up the characterisation post-SEM the parameter 'Pixel Size' (PS) is added to the SEM databar (the blue circle).
	Depth	D*PS
	Bowing	$2{\frac {MW-{\frac {TW+BW}{2}}}{(TW+BW)}}$
	Sidewall angle	$acos({\frac {TW-{tiny\|BW}}{2{\sqrt {D^{2}+{\frac {1}{4}}(TW^{2}-BW^{2})}}}})$

@@ Line 19: / Line 19: @@
 |-
 ! Sidewall angle
-| <math>acos(\frac{TW-BW}{2\sqrt{D^2+\frac{1}{4}(TW^2-BW^2)}})  </math>
+| <math>acos(\frac{TW-{{tiny|BW}}}{2\sqrt{D^2+\frac{1}{4}(TW^2-BW^2)}})  </math>
 |-
 |}