Specific Process Knowledge/Etch/DryEtchProcessing/Bonding: Difference between revisions
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! Sizes of wafers or chips that may bonded and processed | ! Sizes of wafers or chips that may bonded and processed | ||
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![[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-1|DRIE-Pegasus]] | ![[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-1|DRIE-Pegasus-1]] | ||
| 4" wafer | | 4" wafer | ||
| 6" wafer | | 6" wafer | ||
| Samples smaller than a 4" wafer | | Samples smaller than a 4" wafer | ||
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![[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2|DRIE-Pegasus-2]] | |||
| 6" wafer | |||
| 4" wafer | |||
| Samples smaller than a 6" wafer | |||
|- | |- | ||
![[Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch)|ASE]] | ![[Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch)|ASE]] | ||