Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange: Difference between revisions
| Line 12: | Line 12: | ||
In the new design, the gas flow resistance has been reduced by using 1 mm diameter holes in the showerhead instead. This has no impact on processes that have a continuous gas flow - i.e. processes that are not switched. However, for processes with several gas flows that switch on and off, the switching from one gas flow to another will be much more well defined. This has enabled us to run Bosch processes with shorter cycles times. Shorter cycles times means smaller scallops and hence lower roughness and better control. We have not seen any changes to the uniformity of the plasma nor any other side effect. | In the new design, the gas flow resistance has been reduced by using 1 mm diameter holes in the showerhead instead. This has no impact on processes that have a continuous gas flow - i.e. processes that are not switched. However, for processes with several gas flows that switch on and off, the switching from one gas flow to another will be much more well defined. This has enabled us to run Bosch processes with shorter cycles times. Shorter cycles times means smaller scallops and hence lower roughness and better control. We have not seen any changes to the uniformity of the plasma nor any other side effect. | ||
This modification is described by SPTS [[:File:SPTS High Flow Plenum Upgrade for Pegasus Nov 2012.pdf]] | This modification is described by SPTS [[:File:SPTS High Flow Plenum Upgrade for Pegasus Nov 2012.pdf]]. | ||
== Comparison of continuous processes == | == Comparison of continuous processes == | ||