Jump to content

Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions

← Older editNewer edit →
VisualWikitext
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,569 edits
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,569 edits
Line 247: Line 247:
* Quartz wafers need a (semi)conducting layer for clamping
* Quartz wafers need a (semi)conducting layer for clamping
|-
|-
| style="background:LighGrey; color:black"|Possible masking materials
| style="background:LightGrey; color:black"|Possible masking materials
|style="background:LighGrey; color:black"|
|style="background:LightGrey; color:black"|
* AZ photoresist
* AZ photoresist
* zep resist
* zep resist
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DRIE-Pegasus"