Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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*<nowiki>#</nowiki> 150 mm wafers: 1 wafer | *<nowiki>#</nowiki> 150 mm wafers: 1 wafer | ||
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| style="background:Lightgrey; color:black"| | | style="background:Lightgrey; color:black"|Loading | ||
|style="background:lightgrey; color:black"| | |style="background:lightgrey; color:black"| | ||
* Load lock | |||
* MACS | |||
|style="background:lightgrey; color:black"| | |||
* Load lock | |||
|style="background:lightgrey; color:black"| | |||
* Vacuum cassette loader | |||
|style="background:lightgrey; color:black"| | |||
* Vacuum cassette loader | |||
|- | |||
| style="background:Whitesmoke; color:black"|Allowed materials | |||
|style="background:Whitesmoke; color:black"| | |||
* Silicon wafers | * Silicon wafers | ||
* Quartz wafers need a (semi)conducting layer for clamping | * Quartz wafers need a (semi)conducting layer for clamping | ||
|- | |- | ||
| style="background: | | style="background:LighGrey; color:black"|Possible masking materials | ||
|style="background: | |style="background:LighGrey; color:black"| | ||
* AZ photoresist | * AZ photoresist | ||
* zep resist | * zep resist | ||