Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange: Difference between revisions
No edit summary |
No edit summary |
||
| Line 4: | Line 4: | ||
= Modification of showerhead in december 2014 = | = Modification of showerhead in december 2014 = | ||
This page describes why the showerhead has been changed and what process changes have been found. | |||
== Motivation == | |||
The showerhead that distributes the process gasses inside the plasma source was changed. In the old design, the showerhead had a number of 300 µm diameter holes intended to distribute the gas uniformly inside the plasma source. The passage through the holes had a flow resistance that would cause the gasses coming from the MFC in a Bosch process to get mixed up - in this way working against the separation of the etch and dep cycles. | The showerhead that distributes the process gasses inside the plasma source was changed. In the old design, the showerhead had a number of 300 µm diameter holes intended to distribute the gas uniformly inside the plasma source. The passage through the holes had a flow resistance that would cause the gasses coming from the MFC in a Bosch process to get mixed up - in this way working against the separation of the etch and dep cycles. | ||