Specific Process Knowledge/Wafer cleaning: Difference between revisions
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![[Specific Process Knowledge/Wafer cleaning/RCA|RCA]] | ![[Specific Process Knowledge/Wafer cleaning/RCA|RCA]] | ||
![[Specific Process Knowledge/Wafer cleaning/7-up & Piranha| | ![[Specific Process Knowledge/Wafer cleaning/7-up & Piranha|Wafer/Mask Clean baths & Piranha]] | ||
![[Specific Process Knowledge/Wafer cleaning/cleaning with HF|5% HF]] | ![[Specific Process Knowledge/Wafer cleaning/cleaning with HF|5% HF]] | ||
![[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]] | ![[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]] | ||
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*Silicon Oxynitride | *Silicon Oxynitride | ||
*Quartz/fused silica | *Quartz/fused silica | ||
*Pyrex, other glass and Silicon wafers with Cr ONLY allowed in | *Pyrex, other glass and Silicon wafers with Cr ONLY allowed in Mask Cleaning bath or beaker in fumehood | ||
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*Silicon | *Silicon | ||