Specific Process Knowledge/Etch/KOH Etch/ProcessInfo: Difference between revisions
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|Masking | |Masking | ||
|Thermal | |Thermal SiO<sub>2</sub> | ||
|- | |- | ||
|} | |} | ||
| Line 33: | Line 33: | ||
|-|- | |-|- | ||
|Masking | |Masking | ||
|Thermal | |Thermal SiO<sub>2</sub> | ||
|- | |- | ||
|} | |} | ||