Specific Process Knowledge/Etch/KOH Etch/ProcessInfo: Difference between revisions
| Line 36: | Line 36: | ||
{| border="3" cellspacing="1" cellpadding="2" align="center" style="width:500px" | {| border="3" cellspacing="1" cellpadding="2" align="center" style="width:500px" | ||
!QC limits | !QC limits | ||
!Si Etch 1 | !Si Etch 1 | ||
!Si Etch 2 | |||
!Si Etch 3 | !Si Etch 3 | ||
|- | |- | ||
|Etch rate in Si(100) | |Etch rate in Si(100) | ||
|See latest QC test results | |See latest Si Etch 1 QC test results | ||
| | |See latest Si Etch 2 QC test results | ||
|See latest Si Etch 3 QC test results | |||
|- | |- | ||
|Roughness | |Roughness | ||
| Only evaluated visually | |||
| Only evaluated visually | | Only evaluated visually | ||
| Only evaluated visually | | Only evaluated visually | ||
|- | |- | ||
|Nonuniformity | |Nonuniformity | ||
|< 3% | |||
|< 3% | |< 3% | ||
|< 3% | |< 3% | ||