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Specific Process Knowledge/Etch/KOH Etch/ProcessInfo: Difference between revisions

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*[http://labmanager.danchip.dtu.dk/d4Show.php?id=3203&mach=9 The QC procedure for Si Etch: 01]<br>
*[http://labmanager.dtu.dk/d4Show.php?id=1565&mach=248 The QC procedure for Si Etch: 01 and Si Etch 02: KOH]<br>
*[http://labmanager.danchip.dtu.dk/d4Show.php?id=1565&mach=248 The QC procedure for Si Etch: 01]<br>
*[http://labmanager.dtu.dk/d4Show.php?id=5476&mach=407 The QC procedure for Si Etch: 03]<br>
*[http://labmanager.danchip.dtu.dk/view_binary.php?type=data&mach=49 The newest QC data for KOH2]<br>
*[http://labmanager.danchip.dtu.dk/view_binary.php?type=data&mach=248 The newest QC data for KOH3]<br>
{| {{table}}
{| {{table}}
| align="center" |  
| align="center" |  
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|Masking
|Masking
|No masking
|Masking w. silicon oxide
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|}
|}
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{| border="3" cellspacing="1" cellpadding="2" align="center" style="width:500px"
{| border="3" cellspacing="1" cellpadding="2" align="center" style="width:500px"
!QC limits
!QC limits
!Si Etch 01
!Si Etch 1 and 2
!Si Etch 02
!Si Etch 3
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|-
|Etch rate in Si(100)
|Etch rate in Si(100)
|1.3 ± 0.1 µm/min
|See latest QC test results
|1.29 ± 0.06 µm/min
|1.29 ± 0.06 µm/min
|-
|-
|Roughness
|Roughness
| not measured
| Only evaluated visually
| not measured
| Only evaluated visually
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|Nonuniformity
|Nonuniformity
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