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Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 01 processing: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,531 edits
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<br/>The samples used for these tests are 100mm Si wafers coated with a 1.5µm layer of the positive tone resist AZ 5214E.
<br/>The samples used for these tests are 100mm Si wafers coated with a 1.5µm layer of the positive tone resist AZ 5214E.


The conclusion to the tests are that the stitching accuracy of the Aligner: Maskless 01 is ±0.1µm. The machine-to-self overlay accuracy is ±0.5µm (an alignment error of -2µm in X must be compensated, but this error may be subject to machine calibration). The machine-to-machine overlay accuracy could not be determined.
The conclusion to the tests are that the stitching accuracy of the Aligner: Maskless 01 is ±0.1µm. The machine-to-self overlay accuracy is ±0.5µm. The machine-to-machine overlay accuracy could not be determined.


==Stitching==
==Stitching==
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