Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ: Difference between revisions
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The content in here (and the links below) is from email correspondence with SPTS - We pose a question and they answer. The content is, at most, only slightly modified from the original emails and thus may appear somewhat sloppily written. You may, however, find some useful answers. The idea is to share some valuable and potentially very useful information that would otherwise be hidden from everybody except the persons in the correspondence. Hidden deep inside an email correspondence, the information is also very likely to get completely lost should the people involved decide to change job. | The content in here (and the links below) is from email correspondence with SPTS - We pose a question and they answer. The content is, at most, only slightly modified from the original emails and thus may appear somewhat sloppily written. You may, however, find some useful answers. The idea is to share some valuable and potentially very useful information that would otherwise be hidden from everybody except the persons in the correspondence. Hidden deep inside an email correspondence, the information is also very likely to get completely lost should the people involved decide to change job. | ||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Bonding|Bonding wafers]] | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Bonding|Bonding wafers]] | ||