Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions

Revision as of 12:39, 14 August 2008

Deposition of TiW alloy can take place in the Wordentec.

This is done by a sputtering process, process parameters (argon pressure and effect) can be varied, and the deposition rate and surface roughness may change with these settings.

Revision as of 11:47, 20 December 2007 view source BGE (talk \| contribs) Bureaucrats, danchip, Administrators 2,908 edits New page: Deposition of TiW alloy can take place in the Wordentec.		Revision as of 12:39, 14 August 2008 view source Kn (talk \| contribs) danchip 979 edits No edit summary Newer edit →
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	Deposition of TiW alloy can take place in the Wordentec.		Deposition of TiW alloy can take place in the Wordentec.

			This is done by a sputtering process, process parameters (argon pressure and effect) can be varied, and the deposition rate and surface roughness may change with these settings.