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*fast RF power supplies
*fast RF power supplies
the etch and deposition cycles may be split into three separate phases, called Delay, Boost and Main. Following the arguments from above, the third phase (Delay) may be thought of as a short delay that ensures a very low pressure (and thus extremely good ion directionality) before the ion bombardment. The standard etches on the Pegasus only make use of up to two phases.
the etch and deposition cycles may be split into three separate phases, called Delay, Boost and Main. Following the arguments from above, the third phase (Delay) may be thought of as a short delay that ensures a very low pressure (and thus extremely good ion directionality) before the ion bombardment. The standard etches on the Pegasus only make use of up to two phases.
== Processing options on the Pegasus ==
--[[User:jmli|jmli]] ([[User talk:jmli|talk]]) 26 November 2012
The Pegasus has a lot of advanced processing options.
# '''Multiplexing''': As described above, the multiplexed Bosch process may have the etch or passivation cycle each split into three separate phases: Delay, Boost and Main.
# '''Ramping''':Using the ramp option one can change process parameters linearly over the course of each processing step.
# '''Process steps''': Stich any number of processing steps with different parameters to make one continuous process.
# '''Hardware''': The Pegasus has several hardware settings:
## ''Spacers '': The distance to the plasma source may be changed by using different spacers.
## ''Baffle and funnel'': The funnel inside the chamber helps to focus the plasma/ions towards the electrode. They may be taken out but don't expect this option to be part of the parameters that you can change in your experiments.
This gives an infinite process parameter space....


== Improving the Bosch process ==
== Improving the Bosch process ==
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Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange|HERE]] to see a comparison of some the etches before and after the change of the showerhead.
Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange|HERE]] to see a comparison of some the etches before and after the change of the showerhead.
== Processing options on the Pegasus ==
The Pegasus has a lot of advanced processing options.
# '''Multiplexing''': As described above, the multiplexed Bosch process may have the etch or passivation cycle each split into three separate phases: Delay, Boost and Main.
# '''Ramping''':Using the ramp option one can change process parameters linearly over the course of each processing step.
# '''Process steps''': Stich any number of processing steps with different parameters to make one continuous process.
# '''Hardware''': The Pegasus has several hardware settings:
## ''Spacers '': The distance to the plasma source may be changed by using different spacers.
## ''Baffle and funnel'': The funnel inside the chamber helps to focus the plasma/ions towards the electrode. They may be taken out but don't expect this option to be part of the parameters that you can change in your experiments.
This gives an infinite process parameter space....
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