Specific Process Knowledge/Characterization/XPS: Difference between revisions

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More about the different possibilities of the XPS instrument is found here:  
More about the different possibilities of the XPS instrument is found here:  
*[[Specific Process Knowledge/Characterization/XPS/The XPS technique|XPS technique]]
*[[Specific Process Knowledge/Characterization/XPS/XPS technique|The XPS technique]]
*[[Specific Process Knowledge/Characterization/XPS/XPS elemental composition|Elemental composition analysis]]
*[[Specific Process Knowledge/Characterization/XPS/XPS elemental composition|Elemental analysis]]
*[[Specific Process Knowledge/Characterization/XPS/XPS Chemical states |Chemical state analysis]]
*[[Specific Process Knowledge/Characterization/XPS/XPS Chemical states |Chemical sensitivity]]
*[[Specific Process Knowledge/Characterization/XPS/XPS Depth profiling|Depth profiling]]
*[[Specific Process Knowledge/Characterization/XPS/XPS Depth profiling|Depth profiling]]
*[[/Carbon contamination|Carbon contamination]]
*[[/Carbon contamination|Carbon contamination]]

Revision as of 10:05, 15 May 2018

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XPS-ThermoScientific

The XPS system placed at Danchip (room 904, building 346).

In the basement under the cleanroom an X-ray Photoelectron Spectroscopy (XPS) system is installed in room 904. It is a K-Alpha system by ThermoScientific that enables the users to perform elemental and chemical analysis of samples.

The user manual(s), user APV(s), technical information and contact information are be found in LabManager:

XPS-ThermoScientific in LabManager

Elemental analysis

The XPS instrument enables elemental analysis, chemical state analysis on the sample surface or deeper down by a depth profiling. A comparison about techniques and instruments used for elemental analysis at Danchip can be found on the page Element analysis.

More about the different possibilities of the XPS instrument is found here:

Analyzing XPS spectra

The analysis of XPS spectra is an art in itself. Below is collection of examples (ehh..not yet but hopefully quite soon) in which the Avantage software package has been used to extract information from experiments.

Equipment performance of XPS-ThermoScientific

Purpose Chemical analysis
Performance Spot size Can be set between 30µm - 400µm
Probing depth Depending on probed element. Max probe depth lies within 10-200 Å.
Resolution Dependent on probed elements. Concentrations down to about 0,5 atomic % can in some cases be detected.
Charge compensation

Flood gun can be used for charge compensation of non conductive samples

Finding structures Choose measuring spot from camera image (magnified)
Depth profiling Purpose With ion beam etch the top layer of the material can be removed, to do a depth profiling
Ion beam size About 3x1 mm
Substrates Substrate size

Maximum 60x60 mm

Substrate thickness

Maximum height about 20 mm