Specific Process Knowledge/Thin film deposition/Deposition of Hafnium Oxide: Difference between revisions
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More information about hafnium oxide deposition can be found here: for [[Specific Process Knowledge/Thin film deposition/ALD Picosun R200/HfO2 deposition using ALD|ALD1]] and for [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)/HfO2 deposition using ALD2|ALD2 (PEALD)]]. | More information about hafnium oxide deposition can be found here: for [[Specific Process Knowledge/Thin film deposition/ALD Picosun R200/HfO2 deposition using ALD|ALD1]] and for [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)/HfO2 deposition using ALD2|ALD2 (PEALD)]]. | ||
== | ==Deposition of hafnium oxide== | ||
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![[Specific Process Knowledge/Thin film deposition/ALD Picosun R200|ALD]] | ![[Specific Process Knowledge/Thin film deposition/ALD Picosun R200|ALD]] | ||
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*HfO2 | *HfO2 | ||
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* 0 nm - 50 nm | * 0 nm - 50 nm | ||
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* 0.0827 nm/cycle on a flat sample | * 0.0827 nm/cycle on a flat sample | ||
* 0.954-0.122 nm/cycle on a high aspect ratio structures | * 0.954-0.122 nm/cycle on a high aspect ratio structures | ||
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*Very good | *Very good | ||
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* 150 - 300<sup>o</sup>C | * 150 - 300<sup>o</sup>C | ||
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*1-5 100 mm wafers | *1-5 100 mm wafers | ||
*1-5 150 mm wafer | *1-5 150 mm wafer | ||
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*III-V materials (use dedicated carrier wafer) | *III-V materials (use dedicated carrier wafer) | ||
*Polymers (depending on the melting point/deposition temperature, use carrier wafer) | *Polymers (depending on the melting point/deposition temperature, use carrier wafer) | ||
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