Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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''Go back to [[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]''. | ''Go back to [[Specific_Process_Knowledge/Lithography/Coaters#Coater_Comparison_Table|Coater comparison table]]''. | ||
=== Equipment performance and process related parameters === | |||
{| border="2" cellspacing="0" cellpadding="2" | |||
!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
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|style="background:WhiteSmoke; color:black"| | |||
*Spin coating of resist in dedicated bowlsets for labspins | |||
*Spin coating of dirty substances in all purpose | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | |||
|style="background:LightGrey; color:black"|Spin speed | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
*Vacuum chuck: 10 - 7000 rpm <br> | |||
*Edge handling chuck: Max. 3000 rpm | |||
|- | |||
|style="background:LightGrey; color:black"|Spin acceleration | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
*10 - 4000 rpm/s <br> | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
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* 100 mm wafers | |||
* 150 mm wafers | |||
|- | |||
| style="background:LightGrey; color:black"|Allowed materials | |||
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All cleanroom materials ? | |||
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|style="background:LightGrey; color:black"|Batch | |||
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1 | |||
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|} | |||
<br clear="all" /> | |||