Specific Process Knowledge/Lithography: Difference between revisions
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*Automatic Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 Spin Coater: Gamma UV] | *Automatic Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 Spin Coater: Gamma UV] | ||
*Manual Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=331 Spin Coater: Manual Standard Resists] | *Manual Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=331 Spin Coater: Manual Standard Resists] | ||
*UV Mask Aligner: [http://labmanager | *UV Mask Aligner: [http://labmanager.dtu.dk/d4Show.php?id=3822&mach=339 Aligner: MA6 - 2] or [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=44 KS Aligner] | ||
*Automatic Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=329 Developer: TMAH UV-lithography] | *Automatic Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=329 Developer: TMAH UV-lithography] | ||
*Manual Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 Developer: TMAH Manual] | *Manual Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 Developer: TMAH Manual] | ||