Specific Process Knowledge/Thin film deposition: Difference between revisions

Revision as of 14:02, 6 March 2018

3rd Level - Material/Method

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Dielectrica	Semicondutors	Metals	Alloys	Transparent conductive oxides	Polymers
Silicon Nitride - and oxynitride Silicon Oxide Titania (TiO₂, Titanium Oxide) Alumina (Al₂O₃, Aluminium Oxide) Aluminum Nitride (Al_xN_y) Tantalum (Ta₂O₅, Tantalum pentoxide) Cromia (Cr₂O₃, Chromium Oxide) Hafnium Oxide Titanium Nitride - cheramic	Silicon Germanium Zinc Oxide (ZnO)	Aluminium Chromium Cobalt Copper Gold Iron Magnesium Molybdenum Nickel Niobium Palladium Platinum Ruthenium Silver Tantalum Tin Titanium Tungsten	TiW alloy (10%/90% by weight) NiV alloy AlCu CoFe CuTi FeMn MnIr NiCo NiFe YSZ (Yttrium stabilized Zirconium)	ITO (Tin doped Indium Oxide) AZO (Aluminum doped Zinc Oxide)	SU-8 Antistiction coating Topas PMMA

PVD	LPCVD	PECVD	ALD	Coaters	Others
Alcatel - (Will be decommissioned) E-beam evaporator and sputter tool Lesker - Sputter tool PVD co-sputter/evaporation - (Decommissioned) E-beam evaporator and multiple wafer tool Wordentec - E-beam evaporator, sputter and thermal evaporator Thermal evaporator - Thermal evaporator Physimeca - E-beam evaporator (III-V lab) IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching Sputter coater 03 - Gold sputtering system Sputter coater 04 - Gold sputtering system III-V Dielectric evaporator - E-beam evaporation tool	Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride Furnace LPCVD Polysilicon (4" and 6") Deposition of polysilicon Furnace LPCVD TEOS (4") - Deposition of silicon oxide	PECVD - Plasma Enhanced Chemical Vapor deposition Black Magic PECVD - Black Magic PECVD (Carbon)	ALD1 - Atomic Layer Deposition (thermal) ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)	See the Lithography/Coaters page for coating polymers	MVD - Molecular Vapor Deposition Electroplating-Ni - Electrochemical deposition of nickel Electroplating-Cu - Electrochemical deposition of copper MOCVD - Epitaxial growth - Ask the department of photonics if you are interested: Elizaveta Semenova or Kresten Yvind

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 |style="background: LightGray"|
 [[/Deposition of Aluminium|Aluminium]] <br/>
-[[/Deposition of Titanium|Titanium]]<br/>
 [[/Deposition of Chromium|Chromium]]<br/>
 [[/Lesker|Cobalt]]<br/>
-[[/Deposition of Nickel|Nickel]]<br/>
 [[/Deposition of Copper|Copper]]<br/>
+[[/Deposition of Gold|Gold]]<br/>
+[[/Lesker|Iron]]<br/>
+[[/Lesker|Magnesium]]<br/>
 [[/Deposition of Molybdenum|Molybdenum]]<br/>
+[[/Deposition of Nickel|Nickel]]<br/>
+[[/Lesker|Niobium]]<br/>
 [[/Deposition of Palladium|Palladium]]<br/>
+[[/Deposition of Platinum|Platinum]]<br/>
+[[/Lesker|Ruthenium]]<br/>
 [[/Deposition of Silver|Silver]]<br/>
+[[/Deposition of Tantalum|Tantalum]]<br/>
 [[/Deposition of Tin|Tin]]<br/>
-[[/Deposition of Tantalum|Tantalum]]<br/>
+[[/Deposition of Titanium|Titanium]]<br/>
 [[/Deposition of Tungsten|Tungsten]]<br/>
-[[/Deposition of Platinum|Platinum]]<br/>
-[[/Deposition of Gold|Gold]]<br/>
-[[/Lesker|Iron]]<br/>
-[[/Lesker|Magnesium]]<br/>
-[[/Lesker|Niobium]]<br/>
-[[/Lesker|Ruthenium]]<br/>
 |style="background: #DCDCDC"|
 [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>